PURPOSE: To enable all polishing operations to be carried out with a single machine body by arranging intermittently rough finish, medium finish and final finish stations on a track on which a wafer turns around.

CONSTITUTION: On a circular line with the same radius of an index table 1 in the same machine body are provided a plurality of rotary tables 2 rotatable together with the table 1 and on their own axes. On the respective rotary tables 2 are provided chuck tables 3 rotatable along the same circular line together with the rotary tables 2 and rotatable on its own axes and provided on the surface with chuck tables 3 having a work adsorbing function. Above this index table 1 are provided respective stations 4, 5, 6 for performing separately rough, medium and final finish polishing on the same circular line as the rotary table 2. In the respective stations 4, 5, 6 are heads which are vertically moved and rotated by air cylinders and having respectively polishing pads.