Title:
研磨装置、及び、研磨パッドのドレッシング方法
Document Type and Number:
Japanese Patent JP6888753
Kind Code:
B2
Abstract:
To provide a method for dressing a polishing pad with high accuracy using an existing dressing tool and a polishing device for making a thickness of a workpiece uniform by preventing partial excessive polishing of the workpiece.SOLUTION: A double-side polishing device polishes front and rear faces of a workpiece by bringing polishing pads 30a and 7a stuck on front faces of an upper surface plate 30 and a lower surface plate 7 into pressure contact with front and rear faces of a plate-like workpiece and relatively rotating each surface plate 30 and 7 and the workpiece. A dressing tool 40 arranged in place of the workpiece, the upper surface plate 30 and the lower surface plate 7 are relatively rotated in a state in which the upper surface plate 30 is tilted to a vertical shaft. Each polishing pad 30a and 7a is dressed by the dressing tool 40 so that surface pressure acting on the vicinity of an outer peripheral section and the vicinity of an inner peripheral section of each polishing pad 30a and 7a is increased more than that in other portions and thickness in the vicinity of the outer peripheral section and in the vicinity of the inner peripheral section is made thinner than that in the other portions.SELECTED DRAWING: Figure 2
Inventors:
Yoshiyuki Akagi
Application Number:
JP2017120948A
Publication Date:
June 16, 2021
Filing Date:
June 21, 2017
Export Citation:
Assignee:
Hamai Sangyo Co., Ltd.
International Classes:
B24B53/017; B24B37/08; B24B53/00; B24B53/12
Domestic Patent References:
| JP20159293A | ||||
| JP2003257911A | ||||
| JP97982A | ||||
| JP2001179600A | ||||
| JP2015186840A |
Attorney, Agent or Firm:
Yuichi Morita