研磨装置、および研磨パッドの交換時期を決定する方法

Title:

研磨装置、および研磨パッドの交換時期を決定する方法

Document Type and Number:

Japanese Patent JP7421460

Kind Code:

B2

Abstract:

The present invention relates to a technique of determining a time to replace a polishing pad used in a polishing apparatus for polishing a workpiece, such as wafer, substrate, or panel. A polishing apparatus (1) includes: a polishing table (5) configured to support a polishing pad (2); a polishing head (7) configured to press a workpiece (W) against a polishing surface (2a) of the polishing pad (2); a dresser (40) configured to dress the polishing surface (2a) of the polishing pad (2); a detection sensor (60) configured to detect friction between the dresser (40) and the polishing pad (2), the detection sensor (60) being fixed to the dresser (40); and a wear monitoring device (63) configured to determine a wear index value from a plurality of output values of the detection sensor (60) and generate an alarm signal when the wear index value is smaller than a predetermined lower limit.

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Inventors:

Yuta Suzuki
Taro Takahashi
Hiroshi Otaki
Tsuneo Torigoe
Hiroaki Nishida

Application Number:

JP2020163274A

Publication Date:

January 24, 2024

Filing Date:

September 29, 2020

Export Citation:

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Assignee:

Ebara Corporation

International Classes:

B24B49/18; B24B49/10; B24B53/00; B24B53/017; H01L21/304

Domestic Patent References:

JP2010226007A
JP2005022028A
JP2020028955A
JP2014042968A
JP2006255851A
JP2017100254A
JP2009255250A

Foreign References:

KR1020200043216A

Attorney, Agent or Firm:

Tetsuya Hirosawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa

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