Title:
研磨装置及びそのプログラム
Document Type and Number:
Japanese Patent JP5023146
Kind Code:
B2
Abstract:
A polishing apparatus includes a loading section (14) for placing therein a cassette (12) in which a plurality of polishing objects are housed; a first polishing line (20) and a second polishing line (30) for polishing a polishing object; a cleaning line (40) having cleaning machines (42a, 42b, 42c, 42d) for cleaning the polishing object after polishing and a transport unit (44) for transporting the polishing object; a transport mechanism (50) for transporting the polishing object between the loading section (14), the polishing lines (20, 30) and the cleaning line (40); and a control section for controlling the polishing lines (20, 30), the cleaning line (40) and the transport mechanism (50). The control section determines a polishing start time in each of the first and second polishing lines (20, 30) based on a predicted polishing time in each of the first and second polishing lines (20, 30), a predicted transport time in the transport mechanism (50), a predicted cleaning time in the cleaning line (40) and a predicted cleaning start time to start cleaning by driving the transport unit (44) of the cleaning line (40).
Inventors:
Hidetaka Nakao
Masafumi Inoue
Takeda Koichi
Masafumi Inoue
Takeda Koichi
Application Number:
JP2009511893A
Publication Date:
September 12, 2012
Filing Date:
April 17, 2008
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B37/04; B24B37/10; B24B51/00; H01L21/304
Domestic Patent References:
| JP2004265906A | 2004-09-24 | |||
| JP2004241457A | 2004-08-26 | |||
| JP2008091698A | 2008-04-17 | |||
| JPH07201786A | 1995-08-04 |
Foreign References:
| WO2006035337A1 | 2006-04-06 |
Attorney, Agent or Firm:
Isamu Watanabe
Ryoji Kosugi
Tetsuya Hirosawa
Ryoji Kosugi
Tetsuya Hirosawa