Title:
研磨装置、研磨方法、および基板処理装置
Document Type and Number:
Japanese Patent JP7406943
Kind Code:
B2
Abstract:
The present invention relates to a polishing device and a polishing method for polishing the back side of a substrate such as a wafer. The present invention further relates to a substrate processing device provided with the polishing device. This polishing device is provided with a substrate holding unit (10) which holds a substrate (W) in a state with the device surface (2) thereof facing upwards and which rotates the substrate (W); a polishing tool (31) which contacts a non-device surface (1) of the substrate (W) and polishes the non-device surface (1) of said substrate (W); and a contactless washing mechanism (30) which washes the device surface (2) of the substrate (W) while the non-device surface (1) of the substrate (W) is processed with the polishing tool (31).
Inventors:
Masayuki Nakanishi
Application Number:
JP2019160218A
Publication Date:
December 28, 2023
Filing Date:
September 03, 2019
Export Citation:
Assignee:
Ebara Corporation
International Classes:
H01L21/304; B24B21/00; B24B55/08
Domestic Patent References:
| JP2015119161A | ||||
| JP2017108113A | ||||
| JP2006303143A | ||||
| JP2004273961A | ||||
| JP201991886A |
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa