Title:
研磨装置
Document Type and Number:
Japanese Patent JP6544694
Kind Code:
B2
More Like This:
Inventors:
Hiroyoshi Soejima
Application Number:
JP2017003355A
Publication Date:
July 17, 2019
Filing Date:
January 12, 2017
Export Citation:
Assignee:
Applied Science Laboratory Co., Ltd.
International Classes:
B24B29/00; B24B37/02
Domestic Patent References:
| JP7130687A | ||||
| JP11077520A | ||||
| JP2012124378A | ||||
| JP2010172975A | ||||
| JP2003071707A | ||||
| JP2000084842A |
Foreign References:
| US20140364038 |
Attorney, Agent or Firm:
Kyoto International Patent Office