Title:
研磨装置
Document Type and Number:
Japanese Patent JP7152279
Kind Code:
B2
Abstract:
A polishing apparatus capable of increasing an added value is disclosed. The polishing apparatus includes a polishing table configured to support a polishing pad, a top ring configured to press a substrate against the polishing pad, and a liquid supply mechanism configured to supply a liquid onto the polishing pad. The liquid supply mechanism includes a nozzle arm configured to be movable in a radial direction of the polishing table, and a liquid ejection nozzle attached to the nozzle arm. The liquid ejection nozzle is a fan-shaped nozzle having a liquid throttle surface having a tapered shape.
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Inventors:
Takashi Yamazaki
Kobata Itsuki
Ryuichi Kosuge
Chuichi Sone
Kobata Itsuki
Ryuichi Kosuge
Chuichi Sone
Application Number:
JP2018225355A
Publication Date:
October 12, 2022
Filing Date:
November 30, 2018
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B57/02; B24B37/00; B24B37/30; B24B53/017; H01L21/304
Domestic Patent References:
| JP1170464A | ||||
| JP2005508741A | ||||
| JP2003220554A | ||||
| JP2001269868A | ||||
| JP2011530422A | ||||
| JP2014151381A | ||||
| JP201697465A |
Attorney, Agent or Firm:
Tetsuya Hirosawa
Yutaro Watanabe
Yutaro Watanabe