Title:
研磨装置
Document Type and Number:
Japanese Patent JP7216601
Kind Code:
B2
Abstract:
To continuously measure a thickness of a wafer during polishing working.SOLUTION: Pressure of a center portion of a first pipe 62 becomes negative with jetting of air (shown by an arrow A) through an annular air jetting port 66. This causes air to be introduced from outside, as shown by an arrow B. Thus, the air supplied from the outside causes the inside of a penetration path 110 to have high pressure, which can avoid reaching of light shielding substance such as slurry in a jetted state and polishing wastage an upper portion of the penetration path 110. Further, the light shielding substance is removed from the penetration path 110, a mount opening 34a and a center portion of a polishing pad opening 35. This allows light from a light projecting unit 72 in a thickness measuring instrument 71 to easily reach a measurement point for a thickness of a wafer W, accordingly the thickness of the wafer can be properly and continuously measured.SELECTED DRAWING: Figure 3
Inventors:
Masashi Ogata
Application Number:
JP2019078468A
Publication Date:
February 01, 2023
Filing Date:
April 17, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B37/013; B24B41/047; B24B49/04; B24B49/12; B24B55/06; H01L21/304
Domestic Patent References:
| JP2018153879A | ||||
| JP2016209951A | ||||
| JP2014103213A | ||||
| JP2015112675A |
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office