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Title:
POLISHING-FLUID COMPOSITION
Document Type and Number:
Japanese Patent JP2008012668
Kind Code:
A
Abstract:

To provide a polishing-fluid composition that achieves a small surface roughness of a workpiece after polishing while remarkably reducing nano-scratches and allows to polish economically at a high polishing speed, and a manufacturing method for a substrate that has the small surface roughness and whose nano-scratches are remarkably reduced.

The polishing-fluid composition includes an abrasive, having an average particle size of 1-30 nm, and water. The substrate manufacturing method has the step of polishing a substrate by introducing the polishing-fluid composition, in which the abrasive has 79-90 wt.% of a packing ratio, between the substrate and a polishing pad while contacting the substrate with the polishing-fluid composition. The substrate manufacturing method has a polishing step using the polishing-fluid composition.


Inventors:
HONMA YUICHI
TAIRA KOJI
TAKASHINA SHIGEAKI
Application Number:
JP2007222604A
Publication Date:
January 24, 2008
Filing Date:
August 29, 2007
Export Citation:
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Assignee:
KAO CORP
International Classes:
B24B37/00; B82Y10/00; B82Y99/00; C09K3/14; H01L21/304
Domestic Patent References:
JP2003211351A2003-07-29
JP2003155471A2003-05-30
JP2001342455A2001-12-14
JP2001358099A2001-12-26
Attorney, Agent or Firm:
Yoshinori Hosoda



 
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