Title:
POLISHING HEAD AND POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2023127050
Kind Code:
A
Abstract:
To provide a polishing head which enables a polishing tape to be pressed uniformly against a substrate, such as a wafer, with a pressing member.SOLUTION: A polishing head 10 for polishing a substrate W includes: a pressing member 12 which presses a polishing tape 2 against a substrate W; a pressing member holder 30 which holds the pressing member 12; and an actuator 15 which is connected to the pressing member holder 30 and applies a pressing force to the pressing member 12. The pressing member 12 has a rod-like shape having both ends 12a. The pressing member 12 is fitted in a groove 50 formed on a pressing surface 30a of the pressing member holder 30.SELECTED DRAWING: Figure 1
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Inventors:
KASHIWAGI MAKOTO
FUJISAWA MAO
FUJISAWA MAO
Application Number:
JP2022030594A
Publication Date:
September 13, 2023
Filing Date:
March 01, 2022
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B21/08; B24B21/00; H01L21/304
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa
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