Title:
半導体ウェーハを研磨するための研磨ヘッド
Document Type and Number:
Japanese Patent JP2009529246
Kind Code:
A
Abstract:
A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.
Inventors:
Berkster Sur E David
Berkster Sur Jay Jerry
Park Jin O
Jeon in Kwon
Berkster Sur Jay Jerry
Park Jin O
Jeon in Kwon
Application Number:
JP2008558463A
Publication Date:
August 13, 2009
Filing Date:
March 01, 2007
Export Citation:
Assignee:
Inopura Incorporated
International Classes:
H01L21/304; B24B37/04
Domestic Patent References:
| JPH1119868A | 1999-01-26 | |||
| JP2003158105A | 2003-05-30 | |||
| JP2002239894A | 2002-08-28 | |||
| JP2004311506A | 2004-11-04 |
Attorney, Agent or Firm:
Masu Kobori
Takato Tsutsumi
Takato Tsutsumi