Title:
POLISHING LIQUID COMPOSITION FOR SILICON WAFERS
Document Type and Number:
Japanese Patent JP2015122411
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing liquid composition for silicon wafers which enables the decrease in the surface roughness (haze) of a silicon wafer and the surface defect (LPD), and others.SOLUTION: A polishing liquid composition for silicon wafers comprises: silica particles; a nitrogen-containing basic compound; and copolymer including a constitutional unit I expressed by the formula (1) below and a constitutional unit II expressed by the formula (2). In the formula (2), n is an average additional mole number of ethylene oxy groups, which is a number of 2-100. In the copolymer, the mass proportion (Mass of the constitutional unit I/Mass of the constitutional unit II) of the constitutional unit I expressed by the formula (1) to the constitutional unit II expressed by the formula (2) is preferably 50/50 to 99/1. [Chem. 1]
Inventors:
MIURA JOJI
MATSUI YOSHIAKI
KATO YUKI
MATSUI YOSHIAKI
KATO YUKI
Application Number:
JP2013265491A
Publication Date:
July 02, 2015
Filing Date:
December 24, 2013
Export Citation:
Assignee:
KAO CORP
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| JP2013222863A | 2013-10-28 | |||
| JP2010010167A | 2010-01-14 | |||
| JP2009035701A | 2009-02-19 | |||
| JPH1022241A | 1998-01-23 |
Foreign References:
| WO2013157554A1 | 2013-10-24 |
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners