Title:
POLISHING LIQUID FOR SAPPHIRE, STOCK SOLUTION, AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2017197670
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing liquid for sapphire capable of suppressing generation of a chatter vibration of a polishing device in a CMP process of a sapphire substrate, suppressing evaporation of a polishing liquid and agglomeration of an abrasive grain, performing polishing at a high polishing rate for a long time, and polishing a sapphire substrate surface lubricously.SOLUTION: The polishing liquid of the present invention includes: a polar aprotic organic compound having a specific permittivity of not less than 30; an abrasive grain containing colloidal silica; an organic acid; and a liquid medium containing not less than 80 mass% of water, and the polishing liquid has a pH of 8.0-11.0. Further, the content of the polar aprotic organic compound having a specific permittivity of not less than 30 is preferably in a range of 0.05-1.0 in terms of a total mass of the polishing liquid.SELECTED DRAWING: None
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Inventors:
GO YUTAKA
INOUE KEISUKE
TAMADA HARUHISA
YAMASHITA TAKASHI
NOMURA MICHIYUKI
INOUE KEISUKE
TAMADA HARUHISA
YAMASHITA TAKASHI
NOMURA MICHIYUKI
Application Number:
JP2016090282A
Publication Date:
November 02, 2017
Filing Date:
April 28, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| JP2014216369A | 2014-11-17 | |||
| JP2016135840A | 2016-07-28 |
Foreign References:
| CN102337084A | 2012-02-01 | |||
| WO2013069623A1 | 2013-05-16 | |||
| CN104592898A | 2015-05-06 |
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