Title:
POLISHING METHOD AND POLISHING APPARATUS
Document Type and Number:
Japanese Patent JP3886813
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing method and a polishing apparatus for polishing a work with grooves, such as a master body for magnetic pattern transfer, by which the projected surface of a projected/recessed part formed by the grooves can be polished flat.
SOLUTION: When the surface of a work with grooves 31 to 37 is polished, dummy grooves 21 to 24 are formed on both sides of a projected/recessed part L formed by the grooves 31 to 37, as shown in Fig. 1 (B). As a result, a projected surface is formed by projected/recessed parts L, L1, L2, which are formed by the dummy grooves 21 to 24 and the grooves 31 to 37, respectively, and the formed projected surface is polished.
Inventors:
Takao Hirahara
Hitoshi Komoriya
Yutaka Nakamura
Hiroyuki Suzuki
Hitoshi Komoriya
Yutaka Nakamura
Hiroyuki Suzuki
Application Number:
JP2002015324A
Publication Date:
February 28, 2007
Filing Date:
January 24, 2002
Export Citation:
Assignee:
富士通株式会社
International Classes:
B24B37/00; B24B37/005; B24B37/10; C08K3/00; G03F7/00; G03F7/031; C08K5/45; (IPC1-7): B24B37/00; B24B37/04
Domestic Patent References:
| JP1310859A | ||||
| JP7130687A | ||||
| JP10092779A | ||||
| JP2000021882A |
Attorney, Agent or Firm:
Fujiharu Ijima
Nobushige Samejima
Nobushige Samejima