To provide a polishing method for a workpiece surface that avoids complication of work by polishing with one polishing device, reduces polishing time and polishing man-hour, and secures uniformity after the polishing, even when a workpiece such as semiconductor wafer is cambered or bent.

The workpiece 14 is polished continuously by one lapping machine 11 without transferring the workpiece and a carrier 15 from a machining process by two-way drive (a) for polishing the workpiece 14 by rotating only the carrier 15 while the carrier 15 having the set workpiece 14 is grappled between an upper surface plate 12 and a lower surface plate 13 and the upper surface plate 12 and the lower surface plate 13 are fixed to a machining process by four-way drive (b) for polishing the surface of the workpiece 14 by rotating the upper surface plate 12 and the lower surface plate 13 in the mutually opposite directions and rotating the carrier 15.