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Patent Searching and Data


Title:
POLISHING METHOD FOR HGCDTE WAFER
Document Type and Number:
Japanese Patent JPH03111169
Kind Code:
A
Abstract:

PURPOSE: To obtain a mirror surface of less edge roll over while having a sufficient flatness and small surface roughness by using a surface plate composed of a hard resin.

CONSTITUTION: In the case of mercury cadmium tellurium(HgCdTe) monocrystal used as an infrared ray detecting element being subjected to a specular polishing a surface plate composed of a hard resin is used. As a result, the polishing face of small unevenness of the work material surface caused due to the unevenness on this surface plate surface is obtained and owing to its being hard compared to an ordinary abrasive cloth a polishing face can be obtained without almost causing the roll over of a wafer edge in the polishing.


Inventors:
SHIROU AIJI
Application Number:
JP24524989A
Publication Date:
May 10, 1991
Filing Date:
September 22, 1989
Export Citation:
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Assignee:
NIPPON STEEL CORP
International Classes:
B24B37/12; B24B37/14; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Attorney, Agent or Firm:
Tomoyuki Yathata (1 outside)