Title:
POLISHING METHOD FOR MICRODEVICE
Document Type and Number:
Japanese Patent JP3915261
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To efficiently remove an unnecessary projection by polishing the surface of a wafer by pushing a microdevice against a polishing body by pulverizing/compacting liquid being a solid phase in a lump shape or a polishing body by compacting gas being a solid phase.
SOLUTION: A polishing body 14 formed by pulverizing/compacting ice in a small lump shape or formed by compacting dry ice or formed by mixing/ compacting these, is housed inside a casing 12. The patterning surface of a thin film magnetic head wafer 11 to be polished is pushed against the surface of the polishing body 14 while applying pressure 17, and this wafer 11 itself is also rotated as shown by an arrow 18 to polish the surface of the wafer 11 while rubbing, thereby efficiently removes an unnecessary projection such as a burr generated at patterning time without flawing the patterning surface of the wafer 11.
Inventors:
Satoshi Ueshima
Application Number:
JP22754098A
Publication Date:
May 16, 2007
Filing Date:
July 29, 1998
Export Citation:
Assignee:
tdk Corporation
International Classes:
B24B1/00; B24B37/04; B24D3/00; B24D18/00; G11B5/31; (IPC1-7): B24B1/00; B24D3/00; G11B5/31
Domestic Patent References:
| JP6053199A | ||||
| JP63144945A | ||||
| JP50139487A | ||||
| JP10071569A | ||||
| JP60052800A |
Foreign References:
| US3676963 |
Attorney, Agent or Firm:
Keiichi Yamamoto