Title:
研磨方法及び研磨装置、並びに研磨装置制御用プログラム
Document Type and Number:
Japanese Patent JP5305729
Kind Code:
B2
Abstract:
A polishing method includes: a pre-polishing film thickness measurement step of taking a substrate before polishing out of a cassette and measuring a thickness of a polishing film of the substrate with a film thickness measurement device; the pre-polishing substrate withdrawal step of returning the substrate after the pre-polishing film thickness measurement to the cassette; the polishing step of taking the substrate, which has been returned to the cassette, out of the cassette and polishing the substrate; the cleaning/drying step of cleaning and drying the substrate after polishing; the post-polishing substrate withdrawal step of returning the substrate after cleaning/drying to the cassette; and the post-polishing film thickness measurement step of taking the substrate after cleaning/drying, which has been returned to the cassette, out of the cassette and measuring the thickness of the polishing film of the substrate with the film thickness measurement device.
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Inventors:
Tsuneo Torigoe
Mitsunori Sugiyama
Mitsunori Sugiyama
Application Number:
JP2008124554A
Publication Date:
October 02, 2013
Filing Date:
May 12, 2008
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B37/04; B24B51/00; H01L21/304
Domestic Patent References:
| JP11207610A | ||||
| JP10106984A | ||||
| JP2001351958A | ||||
| JP10106981A |
Attorney, Agent or Firm:
Isamu Watanabe
Ryoji Kosugi
Tetsuya Hirosawa
Ryoji Kosugi
Tetsuya Hirosawa