Title:
POLISHING METHOD OF SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP2002059356
Kind Code:
A
Abstract:
To provide a polishing method of a semiconductor wafer devised not to cause small flaws and latent flaws on a surface of the wafer by using specific polishing cloth as polishing cloth to be used in a specular polishing process of the semiconductor wafer, especially in finishing polishing.
The polishing cloth thickness of a napping layer of which is more than 500 μm is used for polishing in the polishing process to polish by using the suede type polishing cloth.
Inventors:
TAKANASHI KAZUHITO
SUZUKI KIYOSHI
WATANABE YOSHINORI
SUZUKI KIYOSHI
WATANABE YOSHINORI
Application Number:
JP2000247829A
Publication Date:
February 26, 2002
Filing Date:
August 17, 2000
Export Citation:
Assignee:
SHINETSU HANDOTAI KK
International Classes:
B24B37/20; B24B37/22; B24B37/24; B24D13/12; B24D13/14; H01L21/304; H01L21/306; (IPC1-7): B24B37/00; H01L21/304
Attorney, Agent or Firm:
Shoji Ishihara