Title:
POLISHING METHOD FOR WORKPIECE AND POLISHING DEVICE THEREOF
Document Type and Number:
Japanese Patent JP3963083
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide polishing technique for a workpiece using a backing pad and capable of reducing the influence of hardness spots of the backing pad and obtaining the workpiece having high degree of flatness with high yield even when using a backing pad having high rate of water absorption.
SOLUTION: A method for polishing a surface of the workpiece by holding the workpiece through the backing pad 4 attached to a holding panel main body 3 and bringing the workpiece into slide-contact with an abrasive cloth comprises a process for removing water or polishing liquid that at least a surface layer part of the backing pad contains before and/or after holding the workpiece. Moreover, a polishing device 1 provided with a means for carrying out a water removing process is provided.
Inventors:
Fukami Teruaki
Fumio Suzuki
Fumio Suzuki
Application Number:
JP2001194589A
Publication Date:
August 22, 2007
Filing Date:
June 27, 2001
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
B24B37/04; B24B37/30; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Domestic Patent References:
| JP4013568A | ||||
| JP9201765A | ||||
| JP4076427A | ||||
| JP2000218522A |
Attorney, Agent or Firm:
Mikio Yoshimiya