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Title:
POLISHING METHOD
Document Type and Number:
Japanese Patent JP2002154049
Kind Code:
A
Abstract:

To provide a polishing method capable of polishing a work with an approximately constant load.

In this polishing method, a work 25 is clamped between a lower surface plate 12 and an upper surface plate 14 which is placed to face the lower surface plate 12, and is suspended from a rod 18 of a cylinder device 16 to be movable vertically, and while a load is applied to the work 25 from the upper surface plate 12, the lower surface plate 12 and the upper surface plate 14 are rotated in a given direction, thereby polishing the both surfaces of the work. This polishing method comprises a first polishing process for applying a first processing pressure from the upper surface plate 14 to the work 25 to polish it, by regulating a pressure in a cylinder chamber of the cylinder device 16, without applying all the weight of the upper surface plate 14 onto the work 25, and a second polishing process following the first polishing process, for applying a second processing pressure higher than the first processing pressure from the upper surface plate 14 to the work to polish it, by re-regulating the pressure in the cylinder chamber 25, without applying all the weight of the upper surface plate 14 onto the work 25.


Inventors:
MIYASHITA CHUICHI
HASEGAWA TAKESHI
KAJIKURA ATSUSHI
MORIYA NORIHIKO
Application Number:
JP2000348169A
Publication Date:
May 28, 2002
Filing Date:
November 15, 2000
Export Citation:
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Assignee:
FUJIKOSHI MACHINERY CORP
International Classes:
B24B37/005; B24B37/08; B24B49/16; B24B51/00; H01L21/304; (IPC1-7): B24B37/00; B24B37/04; H01L21/304
Domestic Patent References:
JPH02152766A1990-06-12
JPS61103774A1986-05-22
JPS6440265A1989-02-10
JPS58137554A1983-08-16
JPS62176753A1987-08-03
JPH079327A1995-01-13
JPH1148126A1999-02-23
JPS61131860A1986-06-19
JP2000225563A2000-08-15
JPH1177513A1999-03-23
JPH0740233A1995-02-10
JPH06170729A1994-06-21
JPS63114869A1988-05-19
Attorney, Agent or Firm:
Takao Watanuki (1 outside)