To provide a polishing method capable of polishing a work with an approximately constant load.
In this polishing method, a work 25 is clamped between a lower surface plate 12 and an upper surface plate 14 which is placed to face the lower surface plate 12, and is suspended from a rod 18 of a cylinder device 16 to be movable vertically, and while a load is applied to the work 25 from the upper surface plate 12, the lower surface plate 12 and the upper surface plate 14 are rotated in a given direction, thereby polishing the both surfaces of the work. This polishing method comprises a first polishing process for applying a first processing pressure from the upper surface plate 14 to the work 25 to polish it, by regulating a pressure in a cylinder chamber of the cylinder device 16, without applying all the weight of the upper surface plate 14 onto the work 25, and a second polishing process following the first polishing process, for applying a second processing pressure higher than the first processing pressure from the upper surface plate 14 to the work to polish it, by re-regulating the pressure in the cylinder chamber 25, without applying all the weight of the upper surface plate 14 onto the work 25.
HASEGAWA TAKESHI
KAJIKURA ATSUSHI
MORIYA NORIHIKO
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