Title:
研磨方法
Document Type and Number:
Japanese Patent JP6794275
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing method by which the whole surface of a substrate including an edge part can be flattened.SOLUTION: According to this polishing method, any one of a chemical mechanical polishing process, in which the whole surface of a first substrate is polished, a surface state of the first substrate at plural measurements on a surface thereof is measured, polishing conditions are decided based on a measurement value of the surface state and an edge polishing database, and the whole surface of a second substrate is brought into slide contact with the a polished surface, and an edge polishing process in which an edge part of the second substrate is topically polished by a polishing tool is executed, and thereafter, the other of the chemical mechanical polishing process and the edge polishing process is executed for the second substrate. The edge polishing process is executed under decided polishing conditions.SELECTED DRAWING: Figure 10
Inventors:
Yu Ishii
Keisuke Uchiyama
Masayuki Nakanishi
Keisuke Uchiyama
Masayuki Nakanishi
Application Number:
JP2017006255A
Publication Date:
December 02, 2020
Filing Date:
January 17, 2017
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B49/03; B24B9/00; B24B21/00; B24B37/30; B24B51/00; H01L21/304
Domestic Patent References:
| JP2006082169A | ||||
| JP2003092274A | ||||
| JP11114792A | ||||
| JP2018014465A |
Foreign References:
| US20140273748 | ||||
| US20070138141 |
Attorney, Agent or Firm:
Isamu Watanabe
Tetsuya Hirosawa
Tetsuya Hirosawa