Title:
POLISHING PAD, POLISHING APPARATUS USING THE SAME, AND METHOD OF POLISHING
Document Type and Number:
Japanese Patent JP2003045831
Kind Code:
A
Abstract:
To provide a polishing pad capable of effectively suppressing adhesion of foreign matters such as dust particles and generation of scratches on the surface to be polished.
This polishing pad, which is used to polish an object, is characterized in that the average grain size, after polishing, of the abrasive grains in the abrasive slurry used for the polishing can be adjusted to 1.5 times the average grain size or smaller before polishing and the surface D hardness is 65 degrees or higher.
Inventors:
SHIMAGAKI MASAAKI
Application Number:
JP2001233575A
Publication Date:
February 14, 2003
Filing Date:
August 01, 2001
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
B24B37/20; B24B37/24; H01L21/304; (IPC1-7): H01L21/304; B24B37/00
Attorney, Agent or Firm:
Ban Toshimitsu