Title:
POLISHING PAD CLEANING TOOL
Document Type and Number:
Japanese Patent JP2023160532
Kind Code:
A
Abstract:
To provide a cleaning tool that can efficiently and reliably clean a polishing pad which is fitted to a polishing device for a CMP, in which at least one of the groove and hole is formed and to which a residue such as a slurry aggregate and polishing chips adheres, without scattering the residue.SOLUTION: A polishing pad cleaning tool 1 includes: a base 10 with a surface 11 in which a plurality of bristle planting holes is formed; and a plurality of types of bristle bundles 20 planted into the respective bristle planting holes. The types of bristle bundles 20 include: a long bristle bundle 21 having a long bristle length; and a short bristle bundle 22 having a bristle length that is shorter than that of the long bristle bundle 21.SELECTED DRAWING: Figure 1
Inventors:
FUJIMORI KAZUMI
Application Number:
JP2022070950A
Publication Date:
November 02, 2023
Filing Date:
April 22, 2022
Export Citation:
Assignee:
SEIWA KOGYO KK
International Classes:
B24B53/017; B24B53/12; H01L21/304
Attorney, Agent or Firm:
Kyoko Hashimoto
Katsuhiko Hashimoto
Daisuke Hashimoto
Katsuhiko Hashimoto
Daisuke Hashimoto