Title:
研磨パッド組成物およびその製造方法ならびに使用
Document Type and Number:
Japanese Patent JP5514806
Kind Code:
B2
Abstract:
Polishing pads for use in chemical mechanical planarization (CMP) or polishing elements/surfaces of such pads are made from a combination of immiscible polymers, for example polyurethane and polyolefin. The polymers are selected on the basis of interfacial interaction, melt index and ratios of melt indices between the polymer phases—a matrix phase and a dispersed phase. By selecting the polymer system such that the two polymers are immiscible in one another and preferentially form separate domains, the dispersed phase can be removed when conditioning or polishing processes expose it. The melt index of individual polymers and the ratio of melt indices determines dispersability of a smaller phase into the matrix, hence the phase size.
Inventors:
Bajai, Rezive
Application Number:
JP2011507575A
Publication Date:
June 04, 2014
Filing Date:
April 28, 2009
Export Citation:
Assignee:
Semiquest Incorporated
International Classes:
H01L21/304; B24B37/24; B24B37/26; C08J5/14; C08L23/00; C08L75/04; C08L101/00
Domestic Patent References:
| JP2005251851A | ||||
| JP2007088464A | ||||
| JP2005512832A | ||||
| JP8269823A | ||||
| JP2008144287A |
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa
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