POLISHING PAD CONTAINING EMBEDDED LIQUID MICROELEMENTS AND METHOD OF MANUFACTURING SAME

Title:

POLISHING PAD CONTAINING EMBEDDED LIQUID MICROELEMENTS AND METHOD OF MANUFACTURING SAME

Document Type and Number:

Japanese Patent JP3920829

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a polishing pad capable of collecting and supplying abrasive slurry evenly, achieving even polishing, and does not make a scratch on the surface of an object to be polished.
SOLUTION: The polishing pad 100 includes a polishing layer 120 comprising a polymeric matrix 130 and liquid microelements 140 embedded in the polymeric matrix 130. Openings 140', which are defined by the embedded microelements, are distributed in the surface of the polishing layer 160.

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Inventors:

Hyun Fu
Sun-Mock Lee
K-Jung Sung
Sun-Gun Kim
Do-Kwon Sung

Application Number:

JP2003324931A

Publication Date:

May 30, 2007

Filing Date:

September 17, 2003

Export Citation:

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Assignee:

Korea Polio Company Limited

International Classes:

H01L21/304; B24B37/20; B24B37/22; B24B37/24; B24D13/14; B24D18/00; B29B7/94; B29C70/60; C08G18/10; C08G18/32; C08G18/48; (IPC1-7): H01L21/304; B24B37/00; C08G18/10; C08G18/32; C08G18/48

Domestic Patent References:

JP2001162515A
JP2003526938A
JP53027367A

Foreign References:

WO2002030617A1

Attorney, Agent or Firm:

Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto

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