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Title:
POLISHING PAD, POLISHING DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH106212
Kind Code:
A
Abstract:

To make a required quantity of abrasives feedable to a polishing surface by having a first principal plane contacting with the polishing surface and a second principal plane to be situated at the side of a polishing plate, while installing a lot of holes for abrasive sump use in piercing through a space between both these principal planes, and making a planar area of the second principal plane larger than that of the first pricipal plane.

A first polishing pad layer 11 or an upper layer and a second polishing pad layer 12 or a lower layer both are installed on a polyester film 13, constituting a polishing pad 10. In these first and second polishing pad layers 11 and 12, a lot of both first and second holes 15 and 16 are formed in each sheet made up of slicing polyurethane foam, for example, 1mm or so, and thereby their principal planes themselves are stuck closely to form sectional projecting type abrasive sump-using holes 14, but at this time, a planar area in a second principal plane of the abrasive sump-using holes 14 is made to be larger than that of the first priciple plane. With this, when the abrasive sump-using hole 14 is compressed, abrasives collected in the second hole 16 can be fed to the surface of a polished member without wastage.


Inventors:
YAMAMOTO YOSHIAKI
Application Number:
JP16776196A
Publication Date:
January 13, 1998
Filing Date:
June 27, 1996
Export Citation:
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Assignee:
NEC CORP
International Classes:
B24B37/20; B24B37/22; B24B37/26; B24D11/00; B24D13/12; B24D13/14; H01L21/304; (IPC1-7): B24B37/00; B24D11/00; H01L21/304
Domestic Patent References:
JPS6458475A1989-03-06
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)