Title:
POLISHING PAD AND POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2007105836
Kind Code:
A
Abstract:
To provide a polishing pad capable of preventing the occurrence of scratches on a substrate surface, and also, capable of optically excellently probing a polishing state during the polishing in the polishing pad used for forming a flat face in glass, a semiconductor, a dielectric/metal complex, and an integrated circuit or the like, and a polishing device.
The polishing pad has a polishing layer 1 and is provided with a through-hole 14 for making a polishing face and the rear face communicate with each other and a path 15 for making the through-hole and the side face of the polishing pad communicate with each other. Such a polishing pad is mounted to the polishing device.
Inventors:
JIYOU KUNITAKA
HONDA TOMOYUKI
KURODA KIN
HONDA TOMOYUKI
KURODA KIN
Application Number:
JP2005299724A
Publication Date:
April 26, 2007
Filing Date:
October 14, 2005
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
B24B37/013; B24B37/20; H01L21/304