Title:
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
Document Type and Number:
Japanese Patent JP2017035781
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing pad having a further improved polishing surface in chemical mechanical polishing (CMP).SOLUTION: A polishing pad 200 for polishing a substrate comprises: a polishing body 200A having a polishing side 201A opposite a back surface 201B; and a polishing surface 200B comprising a plurality of protrusions 202 continuous with the polishing side 201A of the polishing body 200A; thereby providing better slurry retention thereon than polishing pads with conventional groove.SELECTED DRAWING: Figure 2C
Inventors:
PAUL ANDRE LEFEVRE
ALLISON WILLIAM C
ALEXANDER WILLIAM SIMPSON
SCOTT DIANE
HUANG PING
LESLIE M CHARNS
JAMES RICHARD RINEHART
ROBERT KERPRICH
ALLISON WILLIAM C
ALEXANDER WILLIAM SIMPSON
SCOTT DIANE
HUANG PING
LESLIE M CHARNS
JAMES RICHARD RINEHART
ROBERT KERPRICH
Application Number:
JP2016199806A
Publication Date:
February 16, 2017
Filing Date:
October 11, 2016
Export Citation:
Assignee:
NEXPLANAR CORP
International Classes:
B24B37/20; B24B37/24; B24B37/26; H01L21/304
Domestic Patent References:
| JP2005183707A | 2005-07-07 | |||
| JP2000246629A | 2000-09-12 | |||
| JP2002246343A | 2002-08-30 | |||
| JP2001150332A | 2001-06-05 | |||
| JP2005183712A | 2005-07-07 |
Foreign References:
| US6428405B1 | 2002-08-06 | |||
| US5441598A | 1995-08-15 |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto
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