To provide a polishing pad capable of penetrating end point detecting light without decreasing polishing performance and its manufacturing method, the polishing pad manufacturing die and a polishing method of a semiconductor wafer thereof in the process of polishing the semiconductor wafer which employs an optical end point detecting device.
The polishing pad comprises a polishing substrate and a translucent component. In the translucent component, water solubile substance like β-cyclodextrin is dispersed into a bridge polymer like 1 and 2-polybutadiene. Moreover, slurry can not be leaked to rear face side of the polishing pad while in use in such a manner that the translucent component and the polishing substrate are integrally formed in melting. In the manufacturing method, after setting the translucent component to a die for insertion molding, matrix dispersing element composing the polishing substrate is cross-linked inside the die. The polishing method employing the polishing pad is used in the optical end point detecting device.
SHIHO KOUJI
HASEGAWA TORU
KAWAHASHI NOBUO
