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Patent Searching and Data


Title:
研磨パッドおよびその製造方法
Document Type and Number:
Japanese Patent JP2007531638
Kind Code:
A
Abstract:
An article or polishing pad for altering a surface of a work piece includes a polymer matrix created by reaction injection molding of size controlled gas bubbles within a polyurethane matrix. The proposed liquid urethane precursor is first injected into an actuated mold and cured. The molded product is then removed from the mold and double side faced or ground to form a single thin polishing pad comprising a single layer of homogeneous material.

Inventors:
Spencer Preston
Doug Hutchins
Steve Heims
Application Number:
JP2007506849A
Publication Date:
November 08, 2007
Filing Date:
March 22, 2005
Export Citation:
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Assignee:
Rim Pad Tech Limited
International Classes:
B24B37/00; B24B37/04; B24D3/32; B24D18/00; B29C44/00; B29C44/34; C08G18/40; C08J5/14; H01L21/304; C08G101/00
Domestic Patent References:
JP2003062748A2003-03-05
Attorney, Agent or Firm:
Toshiaki Hamada