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Title:
研磨パッドおよびその製造方法
Document Type and Number:
Japanese Patent JP5355004
Kind Code:
B2
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JP5551479A polish device, a polishing pad, and a polish information management system
Inventors:
Mochizuki Yoshimi
Fumio Miyazawa
Application Number:
JP2008234451A
Publication Date:
November 27, 2013
Filing Date:
September 12, 2008
Export Citation:
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Assignee:
Fujibo Holdings Co., Ltd.
International Classes:
B24B37/11; B24B37/20; B24B37/22; B24B37/24; H01L21/304
Domestic Patent References:
JP11333705A
JP2002254295A
JP2006004993A
JP2007007824A
JP2007196336A
JP2007039096A
Attorney, Agent or Firm:
Toshiaki Igarashi



 
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