Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLISHING PAD AND POLISHING MACHINE WITH THE SAME AND USAGE OF POLISHING PAD
Document Type and Number:
Japanese Patent JP2003235774
Kind Code:
A
Abstract:

To provide a polishing pad, a polishing machine with the same and a usage of the polishing pad that removes stains by polishing the surface to which stains stick, can give sufficient glossiness and has biodegradability.

In the polishing pad, the parts in which adjoining fibers (plant fibers such as a sisal hemp or coconut fibers, human hair, animal fibers such as pig hair or the like for example) intersect are formed of rock-shaped fiber accumulations joined by an adhesive (a thermoplastic resin emulsion, a vinyl acetate resin adhesive, etc.). The polishing machine uses the polishing pad as a polishing material and can easily remove stains on a polished surface and give sufficient gloss. The usage of the polishing pad includes the polishing of a polished surface without using a cleaning agent or the like. The polishing pad does not require preparatory work such as a cleaning agent supply process or the like and exhibits a high degree of working efficiency.


Inventors:
HIRAI MIYOKO
SUZUKI YUKIO
SHIKIBE KAZUO
Application Number:
JP2002045126A
Publication Date:
August 26, 2003
Filing Date:
February 21, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOYO CUSHION KK
JAPAN VILENE CO LTD
International Classes:
A47L13/16; A47L13/02; (IPC1-7): A47L13/16; A47L13/02
Attorney, Agent or Firm:
Kojima Kiyoji (1 person outside)