Title:
研磨パッド、研磨パッドの製造方法およびこれを用いた半導体素子の製造方法
Document Type and Number:
Japanese Patent JP7286228
Kind Code:
B2
Abstract:
The present disclosure relates to a polishing pad, a method of manufacturing the polishing pad, and a method of manufacturing a semiconductor device using the same. In the polishing pad, an unexpanded solid-phase blowing agent is included in a polishing composition when a polishing layer is manufactured, and the unexpanded solid-phase blowing agent is expanded during a curing process to form a plurality of uniform pores in the polishing layer, such that defects occurring on a surface of the semiconductor substrate may be prevented. In addition, the present disclosure may provide a method of manufacturing a semiconductor device to which the polishing pad is applied.
Inventors:
Yoon, Jong Wook
Anne, Jane
John, Unson
Ho, Haeyoung
Seo, Jangwon
Anne, Jane
John, Unson
Ho, Haeyoung
Seo, Jangwon
Application Number:
JP2021159778A
Publication Date:
June 05, 2023
Filing Date:
September 29, 2021
Export Citation:
Assignee:
SK enpulse Co.,Ltd.
International Classes:
H01L21/304; B24B37/24
Domestic Patent References:
| JP2019195901A | ||||
| JP2001239455A | ||||
| JP2007081322A | ||||
| JP2019024078A | ||||
| JP2009214272A | ||||
| JP2019069497A | ||||
| JP2020506070A | ||||
| JP2019188594A |
Attorney, Agent or Firm:
SK Patent Attorney Corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito