Title:
研磨パッド、その製造方法およびこれを用いる半導体素子の製造方法
Document Type and Number:
Japanese Patent JP7133683
Kind Code:
B2
Abstract:
The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.
Inventors:
Anne, Jane
Kim, Kyung Hwan
Yun, Sung Hoon
Seo, Jangwon
Myeong, Kansik
Kim, Kyung Hwan
Yun, Sung Hoon
Seo, Jangwon
Myeong, Kansik
Application Number:
JP2021101973A
Publication Date:
September 08, 2022
Filing Date:
June 18, 2021
Export Citation:
Assignee:
SKC solmics Co.,Ltd.
International Classes:
H01L21/304; B24B37/24; B24B53/017; C09K3/14
Domestic Patent References:
| JP2019217627A | ||||
| JP2016170407A | ||||
| JP2006518940A | ||||
| JP2005532176A | ||||
| JP2017510470A | ||||
| JP2019024078A |
Attorney, Agent or Firm:
SK Patent Attorney Corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito
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