Title:
研磨パッド、その製造方法およびこれを用いた半導体素子の製造方法
Document Type and Number:
Japanese Patent JP7348352
Kind Code:
B2
Abstract:
A polishing pad includes a polishing layer, wherein the polishing layer includes zinc (Zn), and a concentration of the zinc (Zn) is 0.5 ppm to 40 ppm parts by weight based on the total weight of the polishing layer. In an exemplary embodiment, a polishing pad is provided wherein a concentration of the zinc (Zn) is 0.5 ppm to 40 ppm parts by weight based on the total weight of the polishing layer, a concentration of the iron (Fe) is 1 ppm to 50 ppm parts by weight based on the total weight of the polishing layer, and a concentration of the aluminum (Al) is 2 ppm to 50 ppm parts by weight based on the total weight of the polishing layer. The polishing pad exhibits physical properties corresponding to the metal concentration, and thus, a polishing rate and defect prevention performance within a target range may be implemented in polishing an object to be polished.
Inventors:
John, Unson
Yoon, Jong Wook
Seo, Jangwon
Moon and Sooyoung
Yoon, Jong Wook
Seo, Jangwon
Moon and Sooyoung
Application Number:
JP2022076342A
Publication Date:
September 20, 2023
Filing Date:
May 02, 2022
Export Citation:
Assignee:
SK enpulse Co.,Ltd.
International Classes:
B24B37/24; B24B37/22; C08G18/10; C08G18/75; C08G18/76; H01L21/304
Domestic Patent References:
| JP2000343411A |
Foreign References:
| WO2001015860A1 |
Attorney, Agent or Firm:
SK Patent Attorney Corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito