Title:
POLISHING PAD, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2003297784
Kind Code:
A
Abstract:
To provide a polishing pad in which the surface temperature of a polishing surface can be controlled not to rise to the vicinity of a softening point.
The polishing pad comprises a hard layer (2) having a face for polishing the surface of a substrate to be polished and supplied with an abrasive, and an underlying high heat conductivity layer (3) having a thermal conductivity of 0.3 w/(mdeg) or above.
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Inventors:
NAKAMURA KENRO
Application Number:
JP2002093088A
Publication Date:
October 17, 2003
Filing Date:
March 28, 2002
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B24B57/02; B24B37/20; B24B37/22; B24B37/24; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; B24B57/02
Attorney, Agent or Firm:
Takehiko Suzue (6 outside)