PURPOSE: To uniformly and easily polish even a three-dimensional curved face by providing a substrate capable of maintaining a fixed shape in a scope of temperature used of a polishing pad and deforming when its temperature exceeds the temperature used.
CONSTITUTION: A polishing pad 204 is formed by fixing a polishing material 203 on a substrate 201 by a fixing means 202, and a handle 205 is provided on it. The substrate 201 is formed by a thermally deformable high molecular material which maintains a fixed shape in the use within a scope of temperature used of the polishing pad 204 and deforms when its temperature exceeds the scope of the temperature used, for example, shape memory resin. The polishing pad 204 is heated above thermal deformation temperature of the thermally deformable high molecular material. Next, it is pressed against a surface 101 to be polished to deform in accordance with a shape of the surface 101 to be polished. Then, it is cooled, is fixed to the shape to obtain a deformed polishing pad 102, and polishing is done by it.
FURUYA HITOSHI
YOSHIZAKI SADAO
IMAI YUTAKA
