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Title:
POLISHING PAD AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2000033553
Kind Code:
A
Abstract:

To hold slurry to be discharged out of a polishing pad by a slurry hold body once at the time of polishing by forming at least a part of a polishing face side where an object to be polished is polished by the slurry hold body.

A slurry hold body 14 is provided in a recessed part 13 to hold slurry once and efficiently in a polishing pad 11 provided with the recessed part 13 on a polishing face 12 side where an object to be polished is polished. In this case, the slurry hold body 14 is made of, for example, a material in which multiporous resin and fiberlike resin are accumulated in layers and a material in which fiberlike resin or pleatlike resin is densely provided in a bottom part of the recessed part 13, and the recessed part 13 is formed toward an outer peripheral direction from a central part of the polishing pad 11.


Inventors:
NAKAJIMA HIDEHARU
Application Number:
JP241399A
Publication Date:
February 02, 2000
Filing Date:
January 08, 1999
Export Citation:
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Assignee:
SONY CORP
International Classes:
B24B37/20; B24B37/24; B24B37/26; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Attorney, Agent or Firm:
Kuninori Funabashi



 
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