Title:
POLISHING PAD AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2005251851
Kind Code:
A
Abstract:
To provide a polishing pad that can accurately and uniformly polish the surface of an object to be polished, such as semiconductor wafer etc., with a strong polishing force, and can suppress the occurrence of scratches, and to provide a method of polishing semiconductor wafer which uses the pad.
In the polishing pad used for chemical mechanical polishing performed for polishing semiconductor wafers, fine particles of an organic resin, such as the fluorine-based resin, polyolefin-based resin, are scattered in a matrix resin in the polishing region of the fine foam of a polyurethane resin. In addition, the SP value of the fine particles of the organic resin is smaller than that of the matrix resin.
Inventors:
SHIMOMURA TETSUO
NAKAMORI MASAHIKO
YAMADA TAKATOSHI
KAZUNO ATSUSHI
OGAWA KAZUYUKI
NAKAI YOSHIYUKI
NAKAMORI MASAHIKO
YAMADA TAKATOSHI
KAZUNO ATSUSHI
OGAWA KAZUYUKI
NAKAI YOSHIYUKI
Application Number:
JP2004057549A
Publication Date:
September 15, 2005
Filing Date:
March 02, 2004
Export Citation:
Assignee:
TOYO TIRE & RUBBER CO
International Classes:
B24B37/20; B24B37/24; B24D11/00; C08J5/14; C08L75/04; C08L101/00; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; B24D11/00; C08J5/14; C08L75/04; C08L101/00
Attorney, Agent or Firm:
Aoyama Aoi
Muneo Yamamoto
Masaishi Nishishita
Muneo Yamamoto
Masaishi Nishishita
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