研磨パッド、研磨ユニット、及び研磨パッドの製造方法

Title:

研磨パッド、研磨ユニット、及び研磨パッドの製造方法

Document Type and Number:

Japanese Patent JP7404129

Kind Code:

B2

Abstract:

To provide a polishing pad which has high durability to bending, and can reduce permeation of a polishing slurry into a base material layer, and a method for manufacturing the same.SOLUTION: A method for manufacturing a polishing pad (100a) includes coating a resin composition containing a photocurable resin onto a laminate (100a) while being irradiated with light, in which the polishing pad (100) has a seal part (105) having a loss elastic modulus at 40°C of 1-10 times of that of the polishing layer, in bending mode measurement of a dynamic viscoelasticity test measured on the condition of a frequency of 0.16 Hz.SELECTED DRAWING: Figure 5

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Inventors:

Teppei Tateno
Tatsuma Matsuoka
Hiroshi Kurihara
Satsuki Narushima

Application Number:

JP2020056517A

Publication Date:

December 25, 2023

Filing Date:

March 26, 2020

Export Citation:

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Assignee:

Fujibo Holdings Co., Ltd.

International Classes:

B24B37/22; B24B37/24; B32B5/24; B32B7/022; H01L21/304

Domestic Patent References:

JP9277163A
JP2012238824A

Attorney, Agent or Firm:

HARAKENZO WORLD PATENT & TRADEMARK

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