Title:
POLISHING PAD AND POLISHING UNIT
Document Type and Number:
Japanese Patent JP2006339571
Kind Code:
A
Abstract:
To provide a polishing pad which is used for providing a flat surface to a glass, a semiconductor, a dielectric/metal composite, an integrated circuit, etc., capable of obtaining stable polishing rate, and furthermore in uniformity within its surface, and to provide a polishing unit.
The polishing pad is composed of, at least, a polishing layer and a cushion layer. The cushion layer has a density of 0.80 to 1.30 and a displacement of 0.1% to 10%, when pushing action is successively applied to it 50 times, under a pressure of 4 to 30 psi. The polishing unit is equipped with this polishing pad.
Inventors:
NAKAYAMA HIROYUKI
SUGIMURA MASAHIRO
JIYOU KUNITAKA
SUGIMURA MASAHIRO
JIYOU KUNITAKA
Application Number:
JP2005165283A
Publication Date:
December 14, 2006
Filing Date:
June 06, 2005
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
H01L21/304; B24B37/20
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