Title:
POLISHING PAD AND WAFER POLISHING METHOD
Document Type and Number:
Japanese Patent JP2022157071
Kind Code:
A
Abstract:
To provide a polishing pad which can polish a polished object with high efficiency, and hardly causes polishing failure in the polished object.SOLUTION: A polishing pad constitutes a polishing surface for polishing a polished object in the presence of a polishing liquid, and has a polishing layer containing a binder resin and innumerable polishing particles. The binder resin is composed of polyvinylidene fluoride. A ratio of initial tensile strength that is tensile strength in an unused state to post-treatment tensile strength that is tensile strength after having been immersed in a strong acid liquid of pH1 from the unused state is 52% or more.SELECTED DRAWING: Figure 1
Inventors:
KITAJIMA SHOTA
GOTO TAKAMASA
KISHIMOTO MASATOSHI
GOTO TAKAMASA
KISHIMOTO MASATOSHI
Application Number:
JP2021061094A
Publication Date:
October 14, 2022
Filing Date:
March 31, 2021
Export Citation:
Assignee:
NORITAKE CO LTD
International Classes:
B24D11/00; B24B37/00; B24B37/24; H01L21/304
Attorney, Agent or Firm:
Patent Attorney Corporation Patena
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