Title:
優れた気密性を有する研磨パッド
Document Type and Number:
Japanese Patent JP7059306
Kind Code:
B2
Abstract:
An embodiment relates to a polishing pad which is used in a chemical mechanical planarization (CMP) process and has excellent airtightness, wherein the polishing pad is excellent in airtightness of a window opening and thus can prevent water leakage that may occur during a CMP process.
Inventors:
Yun, Sung Hoon
Seo, Jangwon
Anne, Jane
Yoon, Jong Wook
Ho, Haeyoung
Seo, Jangwon
Anne, Jane
Yoon, Jong Wook
Ho, Haeyoung
Application Number:
JP2019555847A
Publication Date:
April 25, 2022
Filing Date:
August 06, 2018
Export Citation:
Assignee:
SKC solmics Co.,Ltd.
International Classes:
B24B37/22; B24B37/20; H01L21/304
Domestic Patent References:
| JP2009045694A | ||||
| JP2016505690A | ||||
| JP2016064495A | ||||
| JP2009224384A | ||||
| JP2003289056A |
Foreign References:
| US20020137431 |
Attorney, Agent or Firm:
sk patent corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito
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