To provide a polishing pad having reduced adhesion of dust to the surface of a material to be polished, low levels of scratching and excellent flattening characteristics.
The polishing pad is for polishing a surface to be polished in the presence of a polishing solution which includes a hydrophobic polymer as a base material, and in which a graft-polymer chain having a hydrophilic group is introduced into the surface of the hydrophobic polymer. The hydrophilic group possessed by the graft-polymer chain is preferably a nonionic hydrophilic group selected from the group consisting of hydrophilic groups having an N-monoalkyl substituted structure and hydrophilic groups having an N-dialkyl substituted amide group. An amount of the hydrophilic graft-polymer to be introduced into the base material is preferably 10.0% to 150.0% in terms of graft ratio.
YAGIHARA MORIO
| JP2002224945A | 2002-08-13 | |||
| JP2002371471A | 2002-12-26 |
| WO2002043921A1 | 2002-06-06 |
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda