To provide a polishing pad hardly causing a scratch, and excellent in planarization performance and in polishing stability.

The polishing pad is formed of a fabric comprising fibers whose average fineness is 0.01 to 5 dtex and a polymeric elastomer contained therein. A resin composing the fibers has a water absorption coefficient of 0 to 0.2 mass% when saturated with absorbed water at 50C, the polymeric elastomer has at least one kind of hydrophilic group selected from the group consisting of carboxyl, sulfonic acid, and polyalkylene glycol having 3 or less carbon atoms, and a storage modulus falls in a range of 90 to 900 MPs at 23C and 50C.