Title:
POLISHING PAD
Document Type and Number:
Japanese Patent JP2017035783
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing pad capable of performing mirror finish on a workpiece having a surface shape formed by combining a flat surface with a curved surface.SOLUTION: A polishing pad 3 includes: an elastic pad 31 having a polished surface and a thickness of 0.4-0.6 mm; a base layer 32 supporting the elastic pad 31, being freely deformable and having a thickness of 10 mm; and an adhesive layer 33 joining the elastic pad 31 with the base layer 32 and having a thickness of 0.1-0.2 mm. In the polishing pad 3, a workpiece W sinks down in the polishing pad 3 by 5 mm or more when the workpiece W is pressed to the polishing pad 3 with a polishing pressure of 380 gf/cm.SELECTED DRAWING: Figure 8
Inventors:
ISHII YU
ITO KENYA
TAKAHASHI SHOZO
SUZUKI MIKA
ITO KENYA
TAKAHASHI SHOZO
SUZUKI MIKA
Application Number:
JP2016207763A
Publication Date:
February 16, 2017
Filing Date:
October 24, 2016
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B37/22; B24B37/24
Domestic Patent References:
| JP2014138974A | 2014-07-31 | |||
| JP2011056597A | 2011-03-24 | |||
| JP2005056920A | 2005-03-03 | |||
| JP2010082707A | 2010-04-15 | |||
| JP2005230973A | 2005-09-02 |
Attorney, Agent or Firm:
Isamu Watanabe
Tetsuya Hirosawa
Tetsuya Hirosawa
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