Title:
POLISHING PAD
Document Type and Number:
Japanese Patent JP2022057475
Kind Code:
A
Abstract:
To provide a polishing pad that can improve a fault of profiling an edge part such as sagging and rebounding of an end part, without changing a physical property/bubble structure of a polishing layer.SOLUTION: A polishing pad 3 comprises a polishing layer 4 having a polishing surface for polishing an object to be polished and a cushion layer 6 arranged at the opposite side of the polishing surface of the polishing layer 4. The polishing layer has Shore D-hardness of 40 degrees-70 degrees and has hollow microscopic spheres 4A dispersed thereon. The cushion layer 6 has compressive elasticity modulus of 90% or more.SELECTED DRAWING: Figure 3
Inventors:
TATENO TEPPEI
MATSUOKA RYUMA
KURIHARA HIROSHI
NARUSHIMA SATSUKI
TAKAMIZAWA YAMATO
MATSUOKA RYUMA
KURIHARA HIROSHI
NARUSHIMA SATSUKI
TAKAMIZAWA YAMATO
Application Number:
JP2020165754A
Publication Date:
April 11, 2022
Filing Date:
September 30, 2020
Export Citation:
Assignee:
FUJIBO HOLDINGS INC
International Classes:
B24B37/24; B24B37/22; B24B37/26; C08J5/14; H01L21/304
Attorney, Agent or Firm:
Youichiro Uemura