To set the surface of the film on a substrate as the polishing surface and easily determine a polishing recipe to implement the predetermined polishing process when polishing a work on which the uneven surface is formed.
In polishing a work A using a polishing apparatus X to polish the polishing surface by causing a polishing pad to make relative movement toward the work while the work is pressed to the polishing pad, 1) polishing velocity of work A and 2) the change of the shape of the polishing surface before and after the polishing of the work A are forecasted based on the polishing velocity information of the polishing apparatus and shape information of the work, the polishing time of the work A is determined from the forecasted polishing velocity of the work A, the forecasted change of shape of the work A before and after the polishing, initial film thickness and target remaining film thickness of the work A, and the polishing recipe is determined based on this polishing time.
HAMANAKA MASASHI
SATAKE MITSUNARI
SHINGU KATSUKI
NAKATANI SHOJI
NISHIKI NAOMI
