Title:
POLISHING TAPE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3676726
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing tape suitable for finishing the surface of a precision part such as an optical connector ferrule and a semiconductor wafer and to provide its manufacturing method.
SOLUTION: A polishing tape 10 is so formed that a polishing layer 13 is formed by applying coating agent formed by dispersing polishing material particles of mean grain size of 1-200 mμ in binding material resin liquid, on a base material 11 for a polishing tape, if necessary, via a primer layer 12.
Inventors:
Fujii Kazuhito
Kojiro Okawa
Masahisa Yamaguchi
Miyachi Takaki
Suzu Ura Yasuki
Kojiro Okawa
Masahisa Yamaguchi
Miyachi Takaki
Suzu Ura Yasuki
Application Number:
JP2001353300A
Publication Date:
July 27, 2005
Filing Date:
January 16, 1996
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B24D11/00; B24D3/00; H01L21/304; (IPC1-7): B24D11/00; B24D3/00
Domestic Patent References:
| JP5057624A | ||||
| JP63185577A |
Attorney, Agent or Firm:
Kenji Yoshitake
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma
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